JPH0325406Y2 - - Google Patents
Info
- Publication number
- JPH0325406Y2 JPH0325406Y2 JP11834386U JP11834386U JPH0325406Y2 JP H0325406 Y2 JPH0325406 Y2 JP H0325406Y2 JP 11834386 U JP11834386 U JP 11834386U JP 11834386 U JP11834386 U JP 11834386U JP H0325406 Y2 JPH0325406 Y2 JP H0325406Y2
- Authority
- JP
- Japan
- Prior art keywords
- suction head
- arm
- chip
- pin
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11834386U JPH0325406Y2 (en]) | 1986-07-31 | 1986-07-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11834386U JPH0325406Y2 (en]) | 1986-07-31 | 1986-07-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6324837U JPS6324837U (en]) | 1988-02-18 |
JPH0325406Y2 true JPH0325406Y2 (en]) | 1991-06-03 |
Family
ID=31004710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11834386U Expired JPH0325406Y2 (en]) | 1986-07-31 | 1986-07-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325406Y2 (en]) |
-
1986
- 1986-07-31 JP JP11834386U patent/JPH0325406Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6324837U (en]) | 1988-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106373914B (zh) | 一种芯片键合装置 | |
CN110556307A (zh) | 智能双臂固晶系统 | |
JPH10107128A (ja) | ウェーハリングの供給装置 | |
JPH0325406Y2 (en]) | ||
JPH10163252A (ja) | フリップチップの実装装置 | |
CN207529912U (zh) | 电池片翻片装置 | |
CN219858048U (zh) | 一种贴标机 | |
JP3275743B2 (ja) | チップの実装装置 | |
JP2002141376A (ja) | フリップチップの実装装置およびフリップチップの実装方法 | |
JP3596245B2 (ja) | 電子部品実装装置 | |
JPH1167879A (ja) | 半導体実装方法及びその装置 | |
KR100217285B1 (ko) | 다이이송장치 | |
CN115440627A (zh) | 一种立式贴片机 | |
JPH10163265A (ja) | チップの実装装置 | |
CN222934739U (zh) | 一种金属相框组装的上料机构 | |
KR940002759B1 (ko) | 이너리이드 본딩장치 | |
JPS6317249Y2 (en]) | ||
CN223260579U (zh) | 一种摆臂翻转倒装固晶机构及装置 | |
CN221163730U (zh) | 一种贴辅料生产线 | |
CN219213085U (zh) | 一种触摸屏基板的加工真空夹具 | |
JPS61142046A (ja) | 小片ワ−クのピツクアツプ装置 | |
CN222883412U (zh) | 一种微动开关组装生产线 | |
CN217596373U (zh) | 血糖仪电池盖组装设备 | |
JPH0671155B2 (ja) | 電子部品の突上げ装置 | |
JPH08148529A (ja) | Icチップ実装装置及び実装方法 |